Heat has always been a big problem for powerful phones. At its recent Tech Conference in Shenzhen, REDMAGIC showed off a new way to fix that — a tiny liquid cooling system with an upgraded Turbo Fan 4.0. The company says it’s their most advanced cooling setup yet, and a big step forward for gaming phones, according to The Laotian Times.
Background: Cooling Challenges in Mobile Gaming
As smartphone processors and GPUs grow more powerful, cooling becomes harder. Passive heat pipes and vapor chambers help, but they can’t always sustain heavy loads like gaming or AI inference.
REDMAGIC — the gaming-focused sub-brand of Nubia (ZTE) — has long leaned into hardware cooling innovation. Its ICE series cooling systems in earlier devices already blended mini fans and vapor chambers. This year, it’s pushing that idea into a new territory: true liquid cooling at mobile scale, as noted by Android Authority.
What Was Announced — Key Innovations
Mass-Produced Liquid Cooling System
The system uses a fluorinated cooling liquid with high thermal conductivity and full electrical insulation. It operates safely from –40 °C to 70 °C, ensuring stability in extreme environments.
At its core is a piezoelectric ceramic micropump that circulates coolant through micro-scale flow channels built into the device frame. According to The Laotian Times, REDMAGIC engineers also developed anti-puncture membranes and reinforced seals to survive real-world drops and pressure changes.
A “dual-track” dissipation layout pairs this with a 4D vapor chamber (VC) for even heat spread, reducing hotspots under the CPU and GPU.
Turbo Fan 4.0 (Next-Gen Air Cooling)
Complementing the liquid system is Turbo Fan 4.0, which can spin up to 24,000 rpm, pulling air through redesigned channels for faster, quieter heat removal.
It uses independent, channel-based, and composite airflow paths, giving the device both dust and water resistance (IPX8 rating) — a rare feature for active-fan smartphones, as reported by DroidGamers.
Integration Into Future Devices
The new cooling platform will debut in the REDMAGIC 11 Pro series, expected later this year. As spotted by Gadgets360, this lineup is teased as the first to feature the hybrid cooling architecture.
Why This Matters & What to Watch
Potential Advantages
- Sustained performance: The hybrid liquid-air combo could keep frame rates high during long gaming sessions.
- Thermal flexibility: Wide-range operation helps in hot or cold environments.
- Competitive edge: This gives REDMAGIC a clear differentiator in the gaming-phone market.
- Device longevity: Cooler chips mean less wear on components over time.
Challenges Ahead
Of course, innovation comes with risks: extra moving parts can raise costs, power draw, and potential reliability issues. Real-world stress tests will determine if the micropump and seals truly hold up over months of heat cycling and daily use — something reviewers will surely test once hardware ships.
Conclusion
REDMAGIC’s 2025 Tech Conference showed a rare kind of ambition in smartphone design — bringing true liquid cooling into a consumer-ready form. If the company delivers what it promises, the REDMAGIC 11 Pro could mark the start of a new thermal era for mobile gaming, where power and endurance finally meet in the same device.
Last Updated on October 18, 2025 by Lucy
